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A history of Micron: Our timeline

A Long-Term Innovation Path

Micron began in 1978 as a four-person semiconductor design company in the basement of a Boise, Idaho, dental office. 到1980年,我们的第一家制造厂破土动工, and then just a few years later we introduced the world’s smallest 256K DRAM. In 1994, we earned a spot on the Fortune 500 and steadily grew into an industry leader through our technology innovations, key partnerships, and strategic acquisitions around the world. 看看是哪些里程碑成就了今天的我们.

24 GB HBM3E

Micron Ships World’s First 232-Layer NAND, Extends Technology Leadership

Micron's industry-leading 232-layer 3D NAND provides the foundation for a new wave of end-to-end technologic innovation. 凭借这一行业首创的232层进步, Micron实现了最佳的工业存储密度, 改进的性能和业界领先的I/O速度. 这有助于开启数字化的新机遇, optimization and automation in client, mobile and data center markets.

     


2023 Highlights

  • Micron celebrates 45th anniversary
  • 美光展示了业界首款8高24GB HBM3E内存
  • Micron announces new semiconductor assembly and test facility in India
  • Micron launches memory expansion module portfolio to accelerate CXL 2.0 adoption
  • Micron starts construction on leading-edge memory manufacturing fab in Boise
First 232-Layer NAND

Micron Ships World’s First 232-Layer NAND, Extends Technology Leadership

Micron's industry-leading 232-layer 3D NAND provides the foundation for a new wave of end-to-end technologic innovation. 凭借这一行业首创的232层进步, Micron实现了最佳的工业存储密度, 改进的性能和业界领先的I/O速度. 这有助于开启数字化的新机遇, optimization and automation in client, mobile and data center markets.

     

50K专利写在黑色和粉红色的背景上

Micron Marks 50,000 Patents Milestone

Micron Technology's leadership is founded on continual innovation in memory, storage, semiconductor technologies and beyond. The milestone of achieving our 50,000th patent is a reflection of the creativity of Micron's global team members over the decades and their dedication to drive innovation forward.


2022 Highlights
  • 美光公司推出了世界上最先进的1-Beta节点DRAM技术
  • 美光投资高达1000亿美元在纽约克莱建造巨型工厂
  • Micron invests $15 billion in new Idaho fab
  • Micron ships world’s first 232-layer NAND
  • 美光风险投资基金II承诺为深度科技创业公司投资2亿美元
  • Micron marks 50,000 patents milestone
4 men wearing lab coats and walking with different devices on the side

推出业界首个1α DRAM制程技术

1α (1-alpha) node DRAM products are built using the world’s most advanced DRAM process technology and offer major improvements in bit density, power and performance. The applications for this new DRAM technology are extensive and far reaching — enhancing performance in everything from mobile devices to smart vehicles.


2021 Highlights

  • Micron opens design center in Atlanta
  • Micron issues $1 billion inaugural green bond
  • 美光在尖端内存和R领域投资了1500多亿美元&D  
  • 美光实现全面的全球薪酬平等
  • 美光推出业界首款1α DRAM技术
GDDR6X

推出GDDR6X后,存储器首次采用PAM4多级信令

GDDR6X是世界上最快的离散图形存储解决方案, which is the first to power system bandwidth up to 1 terabyte per second (TB/s). The multilevel signaling innovation in GDDR6X has shattered conventional bandwidth limits, clocking record-breaking speeds while accelerating performance on complex graphics workloads across next-generation gaming applications.

     

176-layer NAND flash

Shipped industry’s first 176-layer NAND flash

The world’s first 176-layer 3D NAND flash memory achieves unprecedented, industry-pioneering density and performance. Together, Micron’s new 176-layer technology and advanced architecture represent a radical breakthrough, enabling immense gains in application performance across a range of storage use cases spanning data center, intelligent edge and mobile devices.


2020 Highlights

  • Micron allocates $50 million to community development for underrepresented groups
  • Micron dedicates $35 million to global communities affected by the COVID-19 pandemic
  • 美光推出全球首款176层NAND闪存
2019 Highlights
  • 《沙巴体育结算平台》将美光公司列入其多元化最佳雇主名单
  • Micron acquires FWDNXT
  • 美光宣布在日本广岛建立先进技术DRAM中心
Quad-Level Cell NAND SSD

美光推出业界首款四能级单元NAND固态硬盘

Micron began shipments of the industry’s first SSD built on revolutionary quad-level cell (QLC) NAND technology. The Micron® 5210 ION SSD provides 33 percent more bit density than triple-level cell (TLC) NAND, 以前使用硬盘驱动器(hdd)服务的寻址段.


2018 Highlights

  • 美光获得首个卓越工作场所®认证
  • Micron celebrates 40th anniversary: 40 Years Strong, Getting Stronger
  • Micron announces $1M grant to advance curiosity in Artificial Intelligence
  • Micron establishes its Center of Excellence for Long-Lifecycle Products in Manassas, Virginia
Showing different IoT Devices

美光宣布面向物联网设备的Authenta™安全技术

Micron® Authenta™ Technology helps enable strong cryptographic IoT device identity and health management in flash memory, providing a unique level of protection for the lowest layers of IoT device software, starting with the boot process.

     

NVDIMM

Micron Doubles Capacity of NVDIMM to 32GB

美光将其DDR4 nvdimm内存的密度提高到了32GB, doubling the capacity of previous solutions. NVDIMMs, also known as persistent memory, can permanently store data in DRAM even after a power loss. The Micron 32GB NVDIMM-N module provides both high-capacity and very fast throughput.


2017 Highlights

  • Micron establishes its Center of Excellence for High-Volume DRAM in Taiwan.
  • Micron establishes Technology Innovation Center of Excellence in Boise
  • 美光被评为多样性100强创新者 & Inclusion by Mogul
GPU

美光推出全球最快的图形DRAM GDDR5X

This memory’s record-high, per-pin data rate enables massive graphics performance and GPGPU computation capability. GDDR5X offers up to 14Gb/s data rates, essentially doubling the bandwidth of prior GDDR5 memory.

     

Micron 512 flash

美光成立Xccela™联盟推广新型接口总线

The creation of the Xcella™ industry consortium helped to accelerate adoption of the Xccela Bus Interface, a new type of high-performance digital interconnect suitable for both volatile and non-volatile memories.


2016 Highlights

  • Micron acquires Inotera Memories
  • Micron named one of the most popular Fortune 500 companies to work for based on employee input
  • 美光在新加坡建立了NAND卓越中心
3D NAND Flash

Micron and Intel Unveil 3D NAND, the Highest-Density Flash Ever Developed

3D NAND marks a significant inflection point in the future of semiconductors. 通过垂直堆叠数据存储单元层, 3D NAND delivers three times higher capacity than planar NAND technology.

     

3D XPoint

美光和英特尔宣布3D XPoint™技术

3D XPoint代表了几十年来第一个新的内存类别. This non-volatile memory is up to 1,000 times faster and has up to 1,000 times greater endurance than NAND.


2015 Highlights

  • 美光在《沙巴体育结算平台》杂志评选的雇主50强中排名第一
  • Micron acquires Tidal Systems
  • Micron acquires Convey Computer
  • Micron acquires Pico Computing
8Gb DDR3 SDRAM

美光率先推出单片8Gb DDR3 SDRAM

This single component provided a significant density increase to 1 gigabyte on a single chip. This higher density enables cost-effective, 为支持大规模而优化的高容量解决方案, data-intensive workloads.

     

World’s Smallest 16nm NAND Flash Device

美光推出全球最小的16nm NAND闪存器件

Micron’s 16nm process technology delivered 16GB of storage on a single die, 有史以来密度最高的平面NAND闪存. Using this process, a single 300mm wafer can create nearly 6TB of storage.

     


2013 Highlights

  • Micron acquires Elpida Memory Inc. and Rexchip Electronics Corporation
First 2.5-Inch PCIe Enterprise SSD

Micron Produces Industry’s First 2.5-Inch PCIe Enterprise SSD

This solution combined a high-performance PCI Express interface with a hot-swappable 2.5英寸的外形和定制的美光控制器, creating new options for enterprise performance scalability and serviceability.

     

DRAM

美光为Ultrabook™设备推出新型低功耗DRAM

DDR3L-RS memory established a new category of “reduced-power” DRAM solutions, 为新一代高性能提供更长的电池寿命, ultrathin devices like laptops, tablets, and Ultrabook systems.
*Ultrabook is a trademark of Intel Corporation or its subsidiaries in the U.S. and/or other countries.

  • Micron celebrates 45th anniversary
  • 美光展示了业界首款8高24GB HBM3E内存
  • Micron announces new semiconductor assembly and test facility in India
  • Micron launches memory expansion module portfolio to accelerate CXL 2.0 adoption
  • Micron starts construction on leading-edge memory manufacturing fab in Boise
First 20nm MLC NAND on a finger tip

美光和英特尔宣布全球首款20nm MLC NAND

This 128Gb MLC memory could store 1Tb of data in a single fingertip-size package with just eight die, setting a new storage benchmark. Additionally, this memory was the first to use an innovative planar cell structure that overcame the scaling constraints of standard floating-gate NAND.

     

Hybrid Memory Cube

美光首次推出混合内存立方体(HMC)架构

Hybrid Memory Cube (HMC) is a revolutionary DRAM architecture that combines high-speed logic with a stack of memory die using through-silicon via (TSV) technology. Learnings from HMC continue to be applied towards future, emerging memory technologies.

2010 Highlights
  • Micron acquires NOR manufacturer Numonyx B.V. from Intel, STMicroelectronics, N.V. and Francisco Partners
SSD

美光推出业界最快的客户端固态硬盘RealSSD™C300

At the time of launch, the C300 was the industry’s fastest SSD for notebook and desktop PCs. With support for the SATA III interface, this SSD delivered 6 Gb/s which significantly boosted throughput speeds for data transfers, application loads and boot times.

     

2008 Highlights
  • 美光与南亚成立DRAM合资企业intera Memories
  • Micron celebrates 45th anniversary
  • 美光展示了业界首款8高24GB HBM3E内存
  • Micron announces new semiconductor assembly and test facility in India
  • Micron launches memory expansion module portfolio to accelerate CXL 2.0 adoption
  • Micron starts construction on leading-edge memory manufacturing fab in Boise
First Pitch-Doubled NAND

美光开发出业界首个双间距NAND

Pitch-doubling was introduced as a lithography technique for increasing bit density without a lithography change. This method involved the separation of bit lines into first and second metal layers, allowing Micron to deliver a 16Gb MLC device on existing 50nm technology.

     

Low-Power RLDRAM 2 Memory

美光公司推出低延迟、低功耗RLDRAM 2内存

Originally designed for networking, this high-performance DRAM quickly became the solution of choice for an unexpected application: DLP-based TVs and projectors. While density has increased over time, reduced latency DRAM remains a staple in networking applications today.

     

Sub-40nm NAND Flash Memory

美光和英特尔首次推出低于40纳米的NAND闪存

This multi-level cell (MLC) NAND flash device was the industry’s first monolithic 32Gb NAND, which enabled high-density solid state storage in very small form factor devices, including digital cameras, personal music players and digital camcorders.

     

  • Micron celebrates 45th anniversary
  • 美光展示了业界首款8高24GB HBM3E内存
  • Micron announces new semiconductor assembly and test facility in India
  • Micron launches memory expansion module portfolio to accelerate CXL 2.0 adoption
  • Micron starts construction on leading-edge memory manufacturing fab in Boise
Women working wearing a blue gown

美光开发猫鼬测试仪,提高精度,降低成本

This internally-developed tester is used exclusively by Micron to increase DRAM test throughput and accuracy. Micron continues to evolve this tester platform to meet new and future memory standards.

     

Micron 16gb DDR2

美光推出全球密度最高的服务器内存模块

Micron’s 16GB DDR2 module served the fast-growing server memory footprint of the 2000s as the rise of virtualization technology packed multiple applications onto single servers. 这些高密度的服务器模块是一种趋势,今天仍在继续.


2006 Highlights
  • Micron acquires Lexar Media
LPDRAM

美光推出高容量、低功耗移动LPDRAM

Micron’s 16MB DRAM — built on a tiny 33mm2 die — enabled higher capacity and lower power in a small footprint. 随着手机从简单的语音过渡到多媒体, LPDRAM requirements increased dramatically, a trend that continues in smartphones today.

     


2005 Highlights
  • 美光和英特尔成立了一家NAND合资企业IM Flash Technologies
Pseudo-Static RAM for Cell Phones

美光推出手机伪静态内存

伪静态SRAM (PSRAM)提供高带宽, 在移动设备中取代SRAM所需的容量和低功耗. Micron’s leadership in PSRAM paved the way for future low-power DRAM products that are used in mobile devices today.

     

DRAM Cell

Micron Develops the Industry’s First 6F2 DRAM Cell

Micron developed an entirely new 6F2 电池架构,以取代业界的8F2 单元标准,使每个晶圆的比特数增加约25%. This higher-density design enabled Micron to reclaim the title as the industry’s most cost-competitive memory producer.


2004 Highlights
  • 美光推出首款2gb NAND闪存沙巴体育结算平台
Image Sensor

Micron Develops 1.3-Megapixel CMOS Image Sensor

Micron’s entry into image sensors established the company as an innovator capable of making CMOS technology with image quality rivaling charge coupled device (CCD) sensors. Today, CMOS传感器是所有类型数码相机的标准配置, 从智能手机到高端专业装备.

     

First 1Gigabit DDR

美光展示业界首个110nm制程1gb DDR

Micron’s 1Gb DDR was built on the most advanced process technology in the world (110nm), 超过了仍在130纳米制程的半导体巨头英特尔和AMD. This chip established Micron as the memory industry leader in both density and interface performance.

     


2002 Highlights

  • 美光展示全球首款1gb DDR DRAM沙巴体育结算平台
  • Micron acquires Toshiba's commodity DRAM operations at Dominion Semiconductor, LLC, a subsidiary of Toshiba Corporation of Japan, located in Manassas, Virginia
SRAM

美光的四数据速率SRAM将内存带宽加倍

Micron’s innovative quad data rate (QDR) architecture effectively doubled the SRAM bandwidth for communication applications such as switches and routers. This unique design used two ports to independently run at a double data rate, resulting in four data items per clock cycle.

First DDR DRAM

Micron Produces Industry’s First DDR DRAM

Micron’s demonstration of the Samurai double data rate (DDR) chipset proved that DDR memory could deliver performance equivalent to the competing Direct RDRAM solution, but at a much lower cost. Ultimately, DDR would become the undisputed industry-standard interface for high-performance DRAM.

     


1999 Highlights

  • The Micron Foundation is established to advance STEM education and support communities.
1998 Highlights
  • Micron becomes one of the largest memory producers in the world with the purchase of Texas Instruments' worldwide memory operations
Windows 3.1 desktop

美光16mb DRAM支持新Windows 3电脑.1

A milestone in density, the 16-megabit DRAM replaced Micron's mainstay 4-megabit DRAM lineup. These higher capacity chips coincided with Microsoft’s release of Windows 3.这使得PC的最小内存需求达到了1兆字节.

     

First RAM products

美光推出首款视频RAM和快速静态RAM沙巴体育结算平台

The introductions of 256K video RAM and fast static RAM broadened Micron’s product portfolio beyond traditional DRAM, 使美光成为差异化内存类型的参与者.

     

1 - Megbit DRAM

Micron Brings 1-Megabit DRAM to Market

A milestone in density, the 1Mb DRAM became a staple for main memory in PCs and graphics cards during the late 1980s and 1990s. Micron’s 1Mb DRAM enabled high-capacity SIMM modules that supported PCs equipped with Microsoft’s new Windows OS.

     


1987 Highlights

  • Micron introduces 1-megabit DRAM product
smallest 256k DRAM chip

美光推出全球最小的256K DRAM芯片

除了作为世界上最小的256K DRAM芯片推出之外, 这款芯片也代表了DRAM密度的行业里程碑. 通过使用更大更容易读取的存储单元, the 256K DRAM was a springboard to future efficiency and profitability for the young memory startup.

     


1984 Highlights

  • 美光推出全球最小的256K DRAM沙巴体育结算平台
  • 美光成为纳斯达克上市公司
First 64K DRAM Product

Micron Ships its First 64K DRAM Product

Micron’s 64K DRAM was the first product manufactured at the company’s newly completed fabrication facility in Boise, Idaho. Micron sold its 64K DRAM into many of the first mass-produced personal computers, including the Commodore 64 home computer.

     


1981 Highlights

  • First 64K DRAM product is shipped
1980 Highlights
  • 美光在爱达荷州博伊西的第一个制造基地破土动工
Micron engineer designing 64K DRAM Design

Micron Engineers Finalize 64K DRAM Design

While not the first company to make 64K DRAM, Micron’s engineers created a newer, smaller version that was lauded as the smallest 64K DRAM design in the world. This innovative design led to high-volume manufacturing of the company’s first 64K product in 1981.

     

4 micron founders holding each others hand

Micron Technology Is Founded

Micron started as a four-person semiconductor design company in the basement of a Boise, Idaho dental office. Micron’s first contract was for the design of a 64K memory chip for Mostek Corporation.

     


1978 Highlights

  • Micron Technology Inc., is founded on Oct. 5, 1978